Dimensity 900 has an octa-core architecture with two Cortex-A78 2.4GHz cores and six Cortex-A55 2GHz cores. LPDDR5 RAM and UFS 3.1 memory for storage are supported, and the built-in 5G modem provides sub-6GHz support with carrier aggregation and up to 120 MHz bandwidth, as well as Bluetooth 5.2 and GNSS connectivity The SoC also integrates a MALI-G68 MC4 GPU and a third-generation independent AI Processing Unit that provides greater energy efficiency to maximize battery life. Other Dimensity 900 5G features include the native HDR image signal processor (ISP) with hardware acceleration, capable of supporting up to four cameras and sensors up to 108MP.
HARDWARE SPECIFICATIONS
Production Process: TSMC at 6nmCPU: 64-bit octa-core2x Cortex-A78 @ 2.4GHz6x Cortex-A55 @ 2GHzGPU: Arm Mali-G68 MC4AI: MediaTek 3rd Generation AI APUMemories:RAM: 4LPDDR4x, LPDDR5Storage: UFS 2.1, UFS 3.1Camera: 108MP, 20MP + 20MPVideo Decoding: 4K 30fps, H.264, H.265 / HEVC, MPEG-1/2/4, VP-9, AV1Video Encoding: 4K 30fps H.264, H.265 / HEVCDisplay: Maximum resolution 2520 x 1080 with maximum refresh at 120HzConnectivity: Wi-Fi 6 (a / b / g / n / ac / ax), Bluetooth 5.2Modem: SA & NSA Sub-6GHz
Dimensity 900 supports MediaTek’s Hyperengine, the new “gaming engine” that intelligently and simultaneously activates the data connectivity of the two SIM and Wi-Fi, ensuring smooth and larvae-free connection while improving performance in games. According to MediTek, you will use the new Dimensity 900 processor in smartphones that will arrive on the market starting in the second quarter of 2021.
