More leaks from China’s Digital Chat Staion reveal a list of specs expected for the Reno9 Pro and 9 Pro+. The Reno9 Pro will be powered by a Snapdragon 778G SoC and will sport a main camera of 64MP. On the other hand, the Reno9 Pro+ will be powered by the MediaTek Dimensity 8000 chipset and the main camera sensor will be a Sony IMX 766 of 50MP. The leak also revealed the packaging of the Oppo Reno9 device which will be in a white rectangular box. The company is expected to unveil the Reno9 series in China next month.